OhmegaPly RCM (Resistor Conductor Material) consists of ED (electrodeposited) copper foil and a NiP (Nickel Phosphorous) resistive alloy. The NiP metal alloy is plated electrically onto the treated side (nodular plated) of the copper foil.
For five decades OhmegaPly has been used in a variety of electronic devices, spanning a broad spectrum of the Electronics Industry. It acts like a resistive “blank slate” – providing the PCB designer with a key tool for addressing contemporary electronic issues requiring passive resistors or resistive films. Applications range from consumer electronics (smart phone MEMS microphones) to aerospace and defense electronics (satellites, space probes, missiles, and fighter aircraft). OhmegaPly’s strength has been its ability to be used in a variety of new ways in new applications.
OhmegaPly RCM is available through Quantic Ohmega as a thin-film material, or through global material suppliers as a laminated product. OhmegaPly RCM is supplied in a variety of foil widths (up to 40”) and thicknesses using Grade 3 copper foil, which exhibits excellent ductility at elevated temperatures and withstands stresses without cracking. Copper thicknesses of 18 µm (0.5 oz) and 35 µm (1 oz) are commonly available.
The Nickel Phosphorous (NiP) resistive layers are available in a range of thicknesses resulting in multiple sheet resistivities. This enables the manufacturing of resistor values from 5 to 50k ohms.
Consists of ED (electrodeposited) copper foil and a NiP (Nickel Phosphorous) resistive alloy. The NiP metal alloy is plated electrically onto the treated side (nodular plated) of the copper foil.
Low thermal coefficient of resistivity minimizes change in foil resistance during lamination as well as during typical normal operation.
Precision plating ensures uniform deposition, resulting in minimal resistance variation. Final etch tolerances benefit from OhmegaPly’s thin and uniform resistive layer.
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© 2023 Quantic Ohmega Ticer
© 2023 Quantic Ohmega Ticer