Embedded Resistive Foils | Quantic Ohmega Ticer |
Embedded Resistive Foils

With over five decades of use, Quantic Ohmega’s products have set the standard for embedded passive components in high frequency, high reliability, mission critical electronics.

OhmegaPly® and TCR® have been used in a variety of electronic devices, spanning a broad spectrum of the Electronics Industry. It acts like a resistive “blank slate” – providing the PCB designer with a key tool for addressing contemporary electronic issues requiring passive resistors or resistive films. Applications range from consumer electronics (smart phone MEMS microphones) to aerospace and defense electronics (satellites, space probes, missiles, and fighter aircraft).

Faster processing and improved performance have generated new challenges in both digital and RF and Microwave printed circuit board (PCB) designs. Our Resistor Conductor Material (RCM), often referred to as thin-film resistor copper foil meet these ever-increasing challenges. Use of RCM allows designers to replace discrete surface resistors with embedded resistors or resistive networks to drive significant performance benefits such as improving signal routing. This results in improved line impedance matching, shorter signal paths, reduced series inductance, elimination of inductive reactance, and reduced EMI, crosstalk and noise. SMT solder joint reduction improves reliability and shortens time to market.

In order to further improve the high-speed/high-frequency performance of circuits utilizing resistive material a product was created called TCR-EHF®. TCR-EHF has the resistor layers deposited onto a very low-profile copper foil which minimizes the losses over the entire length of the trace.

RCM resistors are thin film planar resistive elements that are part of the printed and etched circuitry on a standard PCB layer. RCM is comprised of a copper-conducting layer (copper foil) and a thin-film resistive alloy layer that has been deposited onto the “tooth” or matte side of the copper foil. The copper foils are available in 12 micron (3/8 oz.), 18 micron (1/2 oz.) and 35 micron (1 oz.)  thickness (area weights).

The OhmegaPly is available in a number of standard sheet resistivities expressed in ohms per square (OPS): 10 OPS, 25 OPS, 40 OPS, 50 OPS, 100 OPS, 250 OPS and 377 OPS. Ticer TCR is available in 25 OPS, 50 OPS, 100 OPS, 250 OPS and 1000 OPS.

Based on original equipment manufacturers (OEM) and PCB requirements, the RCM is laminated by independent laminators or PCB manufacturers to specific dielectric materials. It can be bonded to most dielectric materials currently being used by industry.

Compatibility:

Profiled and tested with a wide variety of resin systems, including standard, high performance, lead-free, and specialty resins. It is also ROHS compliant.

Predictability:

Predictability and consistency lot-to-lot and sheet-to-sheet are ensured through extensive testing under varied lamination conditions.

Excellent Thermal Stability

There is minimal resistance change after multiple thermal cycles. Designer and user both benefit from the thermal dissipation properties of TCR foil.