Products | Quantic Ohmega Ticer |
Products

With over five decades of use, Quantic Ohmega’s products have set the standard for embedded passive components in high frequency, high reliability, mission critical electronics.

OhmegaPly® and TCR® have been used in a variety of electronic devices, spanning a broad spectrum of the Electronics Industry. It acts like a resistive “blank slate” – providing the PCB designer with a key tool for addressing contemporary electronic issues requiring passive resistors or resistive films. Applications range from consumer electronics (smart phone MEMS microphones) to aerospace and defense electronics (satellites, space probes, missiles, and fighter aircraft).

Faster processing and improved performance have generated new challenges in both digital and RF and Microwave printed circuit board (PCB) designs. Our Resistor Conductor Material (RCM), often referred to as thin-film resistor copper foil meet these ever-increasing challenges. Use of RCM allows designers to replace discrete surface resistors with embedded resistors or resistive networks to drive significant performance benefits such as improving signal routing. This results in improved line impedance matching, shorter signal paths, reduced series inductance, elimination of inductive reactance, and reduced EMI, crosstalk and noise. SMT solder joint reduction improves reliability and shortens time to market.

In order to further improve the high-speed/high-frequency performance of circuits utilizing resistive material a product was created called TCR-EHF®. TCR-EHF has the resistor layers deposited onto a very low-profile copper foil which minimizes the losses over the entire length of the trace.

Compatibility:

Profiled and tested with a wide variety of resin systems, including standard, high performance, lead-free, and specialty resins. It is also ROHS compliant.

Predictability:

Predictability and consistency lot-to-lot and sheet-to-sheet are ensured through extensive testing under varied lamination conditions.

Excellent Thermal Stability

There is minimal resistance change after multiple thermal cycles. Designer and user both benefit from the thermal dissipation properties of TCR foil.