Communications networks for 5G, Satcom, Defense, Automotive and other applications continue to move toward mmWave frequencies. The antennas necessary to manage the high frequency but lower power signals within these advanced networks are increasingly moving from dish and horn antenna to flat panel, beam forming, AESA and massive MIMO designs. PCB designers and fabricators are looking for stable high frequency PCB dielectrics and smoother, thinner copper foils to realize the low latency, accuracy, and high capacity that these new networks can deliver to users.
It is well known that as signal speed increases, so does the “skin effect” causing the electrical energy to move nearer to the surface of the copper trace in a PCB. At these higher speeds, roughness profile and etching quality of embedded resistor foils are critical to achievement of the best possible insertion loss characteristics. To address this TCR-EHF utilizes a very low-profile copper which minimizes the losses over the entire length of the trace. TCR-EHF has been qualified on various high-performance laminates including those based on PPE/PPO polymer systems.
TCR-EHF is available in the full range of ohmic values and copper weights as standard TCR.
TCR-EHF is available through Quantic Ohmega as a thin-film material, or through global material suppliers as a laminated product.
TCR-EHF is profiled and tested with a variety of resin systems, including standard, high performance, lead-free and specialty resins. It is also ROHS compliant.
Nickel chromium (NiCr) and nickel chromium aluminum silicon (NCAS) alloys are available in a range of sheet resistivities, enabling manufacturing of resistor values from 10 to 100k ohms.
There is minimal resistance change after multiple thermal cycles. Designer and user both benefit from the thermal dissipation properties of TCR-EHF foil.
Low thermal coefficient of resistivity minimizes change in TCR-EHF foil resistance during lamination. Predictability and consistency lot-to-lot and sheet-to-sheet are ensured through extensive testing under varied lamination conditions. The TCR-EHF shows improved high-speed and high-frequency electrical performance due to the lower profile of the copper foil. Lower insertion losses can be realized with TCR-EHF.
Precision vacuum metallization targets ensure uniform ratios of the elements in the deposited alloy, resulting in minimal resistance variation. Final etch tolerances benefit from TCR-EHF’s thin and uniform resistive layer.
TCR-EHF integrated thin-film resistor foil is supplied in a variety of foil widths (up to 51”) and thicknesses using Grade 3 copper foil, which exhibits excellent ductility at elevated temperatures and withstands stresses without cracking. Copper thicknesses of 18 µm (0.5 oz) and 35 µm (1 oz) are commonly available.
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© 2024 Quantic Ohmega Ticer
© 2023 Quantic Ohmega Ticer