No matter the application, there is an OhmegaPly or TCR product to fit your specific needs.




Thin film embedded resistor copper foil for speciality applications.
Embedded resistive materials for mission-critical electronics.
Quantic Ohmega and Quantic Ticer are now one!
Browse our website for the latest in both OhmegaPly® and TCR® materials.
Products
OhmegaPly 377-FS
OhmegaPly RCM
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TCR® Brochure Chinese -
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OhmegaPly MTR TOC RCM Datasheet -
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OhmegaPly VSP RCM Datasheet
OhmegaPly Laminates
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OhmegaPly Laminate -
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General Specification for OhmegaPly Laminate and RCM
OhmegaPly® MTR™ (Micro Trace Resistors™)
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OhmegaPlyMTR Brochure
OhmegaPly ORBIT
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ORBIT Brochure -
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OhmegaFlex
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OhmegaFlex Brochure -
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OhmegaPly for Flex Circuit-700px -
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OhmegaFlex Heater Postcard-700px
OhmegaPly RF
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OhmegaPly RF_Absorbers -
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OhmegaPly RF_Power Dividers -
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Insertion Loss-Rogers 3850 -
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Insertion Loss-Arlon CLTE-XT -
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Ohmega/FaradFlex®
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Ohmega Faradflex brochure
OhmegaPly Design and Processing
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Ohmega Design Version 2.1 -
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Overview Processing Guide
TCR
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TCR® Brochure in English -
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TCR Brochure in Chinese -
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TCR Specifications
OhmegaPly
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TCR® Brochure in English -
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TCR Brochure in Chinese -
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TCR Specifications
TCR-EHF
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TCR® Brochure Chinese -
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OhmegaPly MTR TOC RCM Datasheet -
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OhmegaPly VSP RCM Datasheet
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OhmegaPly Laminate -
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General Specification for OhmegaPly Laminate and RCM
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OhmegaPlyMTR Brochure
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ORBIT Brochure -
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Orbit-22ohm-700px
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OhmegaFlex Brochure -
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OhmegaPly for Flex Circuit-700px -
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OhmegaFlex Heater Postcard-700px
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OhmegaPly RF_Absorbers -
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OhmegaPly RF_Power Dividers -
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Insertion Loss-Rogers 3850 -
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Insertion Loss-Arlon CLTE-XT -
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Fig 10
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Ohmega Faradflex brochure
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Ohmega Design Version 2.1 -
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Overview Processing Guide
TCR is a thin-film resistor foil that meets the ever-increasing challenges of packaging high-speed, high-density electronic devices.
Manufactured using a thin-film vapor disposition, TCR ensures excellent uniformity of resistor material across the sheet for higher yields and improved resistor tolerances in multilayer organic packages. It reduces form factor, increases the space available for active components, reduces weight and improves performance. TCR utilizes existing printed circuit fabrication processes and chemistries.
Increasing demand for faster processing and improved performance have generated new challenges in both digital and RF printed circuit board designs. Replacing discrete resistors on the surface of an electronic assembly improves signal routing, resulting in improved line impedance matching, shorter signal paths, reduced series inductance, elimination of inductive reactance, and reduced EMI, crosstalk and noise. SMT solder joint reduction improves reliability and shortens time to market.
Advantages of TCR
Availability Compatibilty Design Versatility Excellent Thermal Stability Performance & Predictability Resistor Tolerances Technical Data AvailabilityTCR is available through Quantic Ohmega as a thin-film material, or through global material suppliers as a laminated product.
CompatibiltyTCR is profiled and tested with a wide variety of resin systems, including standard, high performance, lead-free and specialty resins. It is also ROHS compliant.
Design VersatilityNickel chromium (NiCr) and nickel chromium aluminum silicon (NCAS) alloys are available in a range of sheet resistivities, enabling manufacturing of resistor values from 10 to 100k ohms.
Excellent Thermal StabilityThere is minimal resistance change after multiple thermal cycles. Designer and user both benefit from the thermal dissipation properties of TCR foil.
Performance & PredictabilityLow thermal coefficient of resistivity minimizes change in TCR foil resistance during lamination. Predictability and consistency lot-to-lot and sheet-to-sheet are ensured through extensive testing under varied lamination conditions.
Resistor TolerancesPrecision vacuum metallization targets ensure uniform ratios of the elements in the deposited alloy, resulting in minimal resistance variation. Final etch tolerances benefit from TCR’s thin and uniform resistive layer.
Technical DataTCR integrated thin-film resistor foil is supplied in a variety of foil widths (up to 51”) and thicknesses using Grade 3 copper foil, which exhibits excellent ductility at elevated temperatures and withstands stresses without cracking. Copper thicknesses of 18 µm (0.5 oz) and 35 µm (1 oz) are commonly available.
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TCR® Brochure in English -
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TCR Brochure in Chinese -
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TCR Specifications
OhmegaPly RCM (Resistor Conductor Material) consists of ED (electrodeposited) copper foil and a NiP (Nickel Phosphorous) resistive alloy. The NiP metal alloy is plated electrically onto the treated side (nodular plated) of the copper foil.
For five decades OhmegaPly has been used in a variety of electronic devices, spanning a broad spectrum of the Electronics Industry. It acts like a resistive “blank slate” – providing the PCB designer with a key tool for addressing contemporary electronic issues requiring passive resistors or resistive films. Applications range from consumer electronics (smart phone MEMS microphones) to aerospace and defense electronics (satellites, space probes, missiles, and fighter aircraft). OhmegaPly's strength has been its ability to be used in a variety of new ways in new applications.
Availability Design Versatility Material Product Performance Resistor Tolerances AvailabilityOhmegaPly RCM is available through Quantic Ohmega as a thin-film material, or through global material suppliers as a laminated product. OhmegaPly RCM is supplied in a variety of foil widths (up to 40”) and thicknesses using Grade 3 copper foil, which exhibits excellent ductility at elevated temperatures and withstands stresses without cracking. Copper thicknesses of 18 µm (0.5 oz) and 35 µm (1 oz) are commonly available.
Design VersatilityThe Nickel Phosphorous (NiP) resistive layers are available in a range of thicknesses resulting in multiple sheet resistivities. This enables the manufacturing of resistor values from 5 to 50k ohms.
MaterialConsists of ED (electrodeposited) copper foil and a NiP (Nickel Phosphorous) resistive alloy. The NiP metal alloy is plated electrically onto the treated side (nodular plated) of the copper foil.
Product PerformanceLow thermal coefficient of resistivity minimizes change in foil resistance during lamination as well as during typical normal operation.
Resistor TolerancesPrecision plating ensures uniform deposition, resulting in minimal resistance variation. Final etch tolerances benefit from OhmegaPly’s thin and uniform resistive layer.
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TCR® Brochure in English -
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TCR Brochure in Chinese -
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TCR Specifications
Communications networks for 5G, Satcom, Defense, Automotive and other applications continue to move toward mmWave frequencies. The antennas necessary to manage the high frequency but lower power signals within these advanced networks are increasingly moving from dish and horn antenna to flat panel, beam forming, AESA and massive MIMO designs. PCB designers and fabricators are looking for stable high frequency PCB dielectrics and smoother, thinner copper foils to realize the low latency, accuracy, and high capacity that these new networks can deliver to users.
It is well known that as signal speed increases, so does the “skin effect” causing the electrical energy to move nearer to the surface of the copper trace in a PCB. At these higher speeds, roughness profile and etching quality of embedded resistor foils are critical to achievement of the best possible insertion loss characteristics. To address this TCR-EHF utilizes a very low-profile copper which minimizes the losses over the entire length of the trace. TCR-EHF has been qualified on various high-performance laminates including those based on PPE/PPO polymer systems.
TCR-EHF is available in the full range of ohmic values and copper weights as standard TCR.


TCR-EHF is available through Quantic Ohmega as a thin-film material, or through global material suppliers as a laminated product.
CompatibiltyTCR-EHF is profiled and tested with a variety of resin systems, including standard, high performance, lead-free and specialty resins. It is also ROHS compliant.
Design VersatilityNickel chromium (NiCr) and nickel chromium aluminum silicon (NCAS) alloys are available in a range of sheet resistivities, enabling manufacturing of resistor values from 10 to 100k ohms.
Excellent Thermal StabilityThere is minimal resistance change after multiple thermal cycles. Designer and user both benefit from the thermal dissipation properties of TCR-EHF foil.
Performance & PredictabilityLow thermal coefficient of resistivity minimizes change in TCR-EHF foil resistance during lamination. Predictability and consistency lot-to-lot and sheet-to-sheet are ensured through extensive testing under varied lamination conditions. The TCR-EHF shows improved high-speed and high-frequency electrical performance due to the lower profile of the copper foil. Lower insertion losses can be realized with TCR-EHF.
Resistor TolerancesPrecision vacuum metallization targets ensure uniform ratios of the elements in the deposited alloy, resulting in minimal resistance variation. Final etch tolerances benefit from TCR-EHF’s thin and uniform resistive layer.
Technical DataTCR-EHF integrated thin-film resistor foil is supplied in a variety of foil widths (up to 51”) and thicknesses using Grade 3 copper foil, which exhibits excellent ductility at elevated temperatures and withstands stresses without cracking. Copper thicknesses of 18 µm (0.5 oz) and 35 µm (1 oz) are commonly available.
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OhmegaPly and TCR embedded resistors can be used in an ever-growing range of applications.
Military/Aerospace
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Ohmega Resistors for PWB's Recent Development in Lead-Free and Microwave Applications -
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OhmegaPly in Mars Express Beagle2 -
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Integral Resistors in High Frequency Printed Wiring Board -
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Characterization of Integrated Resistors for Broadband Telecom Printed Circuit Boards
Computer/Telecommunications
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Design and Use of OhmegaPly Resistors for Series and Parallel Termination -
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BGA Termination Alternative By Bruce Mahler -
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When 15% Is Better Than 1% -
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The Effect of Miniaturization on Embedded Resistors -
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Passive Devices Buried Resistors By Cynthia Martin -
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Characterization of Integrated Resistors for Broadband Telecom Printed Circuit Boards -
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ORBIT Brochure -
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Applications Using Buried Resistor Technology by Clint Beliveau
Consumer Electronics
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When 15% Is Better Than 1% -
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Thermal Cycling and ESD Evaluation of Embedded Resistors and Capacitors in PWB -
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Passive Devices Buried Resistors By Cynthia Martin -
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OhmegaPly Integral Planar Resistors The Lower Cost Alternative -
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Ohmega Resistors for PWB's Recent Development in Lead-Free and Microwave Applications -
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Incorporating Planar Resistors in PCB Designs -
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Embedded Passives to Shrink PC Boards -
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Embeddded Passives, go for it IPC 2006 -
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Planar Resistor for High-Speed Multilayer Boards -
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Benefits of Embedded Resistors -
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A Closer Look at Embedded Passives
Microwave Devices
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RF Microwave PCB for Space Applications By Cimulec -
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Quad-Ridge Horn Utilizing Resistive Films to Reduce Sidelobe -
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Ohmega Resistors for PWB's Recent Development in Lead-Free and Microwave Applications -
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Integral Resistors in High Frequency Printed Wiring Board -
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GaN Power Amplifiers -
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Characterization of Integrated Resistors for Broadband Telecom Printed Circuit Boards -
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Fabrication-Guidelines-RT-duroid-6202PR-High-Frequency-Laminates -
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A novel heterodyne interferometer for millimetre and submillimetre astronom -
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OhmegaPly RF
Medical Electronics
Flexible Circuit
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Thermal Cycling and ESD Evaluation of Embedded Resistors and Capacitors in PWB -
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OhmegaFlex Brochure
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Ohmega Resistors for PWB's Recent Development in Lead-Free and Microwave Applications -
Download PDF
OhmegaPly in Mars Express Beagle2 -
Download PDF
Integral Resistors in High Frequency Printed Wiring Board -
Download PDF
Characterization of Integrated Resistors for Broadband Telecom Printed Circuit Boards
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Download PDF
Design and Use of OhmegaPly Resistors for Series and Parallel Termination -
Download PDF
BGA Termination Alternative By Bruce Mahler -
Download PDF
When 15% Is Better Than 1% -
Download PDF
The Effect of Miniaturization on Embedded Resistors -
Download PDF
Passive Devices Buried Resistors By Cynthia Martin -
Download PDF
Characterization of Integrated Resistors for Broadband Telecom Printed Circuit Boards -
Download PDF
ORBIT Brochure -
Download PDF
Applications Using Buried Resistor Technology by Clint Beliveau
-
Download PDF
When 15% Is Better Than 1% -
Download PDF
Thermal Cycling and ESD Evaluation of Embedded Resistors and Capacitors in PWB -
Download PDF
Passive Devices Buried Resistors By Cynthia Martin -
Download PDF
OhmegaPly Integral Planar Resistors The Lower Cost Alternative -
Download PDF
Ohmega Resistors for PWB's Recent Development in Lead-Free and Microwave Applications -
Download PDF
Incorporating Planar Resistors in PCB Designs -
Download PDF
Embedded Passives to Shrink PC Boards -
Download PDF
Embeddded Passives, go for it IPC 2006 -
Download PDF
Planar Resistor for High-Speed Multilayer Boards -
Download PDF
Benefits of Embedded Resistors -
Download PDF
A Closer Look at Embedded Passives
-
Download PDF
RF Microwave PCB for Space Applications By Cimulec -
Download PDF
Quad-Ridge Horn Utilizing Resistive Films to Reduce Sidelobe -
Download PDF
Ohmega Resistors for PWB's Recent Development in Lead-Free and Microwave Applications -
Download PDF
Integral Resistors in High Frequency Printed Wiring Board -
Download PDF
GaN Power Amplifiers -
Download PDF
Characterization of Integrated Resistors for Broadband Telecom Printed Circuit Boards -
Download PDF
Fabrication-Guidelines-RT-duroid-6202PR-High-Frequency-Laminates -
Download PDF
A novel heterodyne interferometer for millimetre and submillimetre astronom -
Download PDF
OhmegaPly RF
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Download PDF
Thermal Cycling and ESD Evaluation of Embedded Resistors and Capacitors in PWB -
Download PDF
OhmegaFlex Brochure